发明名称 THERMOSETTING SILICONE RESIN COMPOSITION, AND SILICONE RESIN-CONTAINING STRUCTURE AND OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULANT OBTAINED USING SAME
摘要 The purpose of the present invention is to provide a thermosetting silicone resin composition containing a tin compound and having excellent thermosetting properties and stability at room temperature. This thermosetting silicone resin composition contains an organopolysiloxane (A) having a silanol group, a silane compound (B) having an alkoxysilyl group, a tin compound (C), and a zinc compound (D). The tin compound (C) content is 0.001-1 parts by mass relative to 100 parts by mass of the total of the organopolysiloxane (A) and the silane compound (B). The zinc compound (D) content is 0.01-5 parts by mass relative to 100 parts by mass of the total of the organopolysiloxane (A) and the silane compound (B). The mass ratio (C/D) value of the tin compound (C) relative to the zinc compound (D) is less than 1.
申请公布号 KR101332171(B1) 申请公布日期 2013.11.25
申请号 KR20137006541 申请日期 2011.11.08
申请人 发明人
分类号 C08K3/10;C08K5/098;C08L83/06;H01L23/29 主分类号 C08K3/10
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