发明名称 Method for arranging electrostatic chucks and apparatus using the same
摘要 An electrostatic chuck apparatus for absorbing a substrate and a method for arranging the same are provided to enhance efficiency by arranging distributively electrostatic chucks or supplying selectively electric power to the electrostatic chucks. A first electrostatic chuck(200) is loaded on a flat plate to absorb a substrate by using electrostatic force. A second electrostatic chuck(210) is loaded on the flat plate adjacent to the first electrostatic chuck, to select an absorbing state to the substrate. A control unit supplies electric power to the first electrostatic chuck and supplies selectively the electric power to the second electrostatic chuck. The second electrostatic chuck is formed with a dummy electrostatic chuck. The first electrostatic chuck is installed at an edge of the flat plate. The second electrostatic chuck is installed at a place except for the edge of the flat plate.
申请公布号 KR101332662(B1) 申请公布日期 2013.11.25
申请号 KR20060108174 申请日期 2006.11.03
申请人 发明人
分类号 H01L21/687 主分类号 H01L21/687
代理机构 代理人
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