发明名称 |
APPARATUS AND METHOD FOR CONDUCTIVE METAL BALL BONDING WITH ELECTROSTATIC DISCHARGE DETECTION |
摘要 |
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer. |
申请公布号 |
HK1127762(A1) |
申请公布日期 |
2013.11.22 |
申请号 |
HK20090105059 |
申请日期 |
2009.06.05 |
申请人 |
WESTERN DIGITAL TECHNOLOGIES INC. |
发明人 |
PORNCHAI RAKPONGSIRI;JEERASAK POTHAM |
分类号 |
B23K;H01R |
主分类号 |
B23K |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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