| 摘要 |
PURPOSE: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device package using the same are provided to improve the contamination of a semiconductor device and a mold and to improve the reliability of the semiconductor device package. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resins, hardeners, curing accelerators, inorganic filler, and additives prepared by melt-blending a compound represented by chemical formula 1 and a compound represented by chemical formula 2 in a ratio of 4:1~6:1. In chemical formula 1, n is an integer of 30 ~ 450. In chemical formula 2, R is a t-butyl group. |
