| 摘要 |
A method for applying a soldering material on the conductive pillar of a wafer includes a step for providing a soldering material furnace with an upper opening part, loading a melted soldering material in the soldering material furnace, and connecting the soldering material furnace to an input source, a step for providing a plate to the upper opening part and forming holes in the plate, a step for forming soldering material bumps by using the upper hole the soldering material of the input source, a step for performing a size analysis step by providing a visual device, a step for providing a work piece and forming conductive fillers on the work piece, moving the plate against the work piece, and making the conductive filler face a soldering bump, and a step for making the conductive filler touch the soldering material bump and arranging the soldering material bump on the conductive filler. [Reference numerals] (S101) Providing a soldering material furnace with an upper opening part, loading a melted soldering material in the soldering material furnace, and connecting the soldering material furnace to an input source;(S103) Providing a plate to the upper opening part and having, a plate has multiple drilling and multiple first location mark;(S105) Forming multiple soldering material bumps projected in plate by using pressure to pressurize melt soldering material source into drilling through upper opening part and plate;(S107) performing a size analysis step by providing a visual device and stopping pressurizing the pressure source when the size of soldering material bumper reaches predetermined value;(S109) Providing a work piece and forming conductive fillers on the work piece, moving the plate against the work piece, and making the conductive filler face a soldering bump;(S111) Making the conductive filler touch the soldering material bump and arranging the soldering material bump on the conductive filler |
