| 摘要 |
PURPOSE: A semiconductor package including an electromagnetic wave shielding unit and a manufacturing method thereof are provided to remove an electromagnetic wave from the outside through a grounding operation by forming a division type electromagnetic wave shielding unit to be grounded. CONSTITUTION: A plurality of semiconductor chips and a passive device are conductively attached to a substrate (10). A grounding unit (20) is formed to independently divide the plurality of semiconductor chips and the passive device. The plurality of semiconductor chips and the passive device are sealed with molding compound resins. Electromagnetic wave shielding materials (22) are coated on the surfaces of the molding compound resins and the upper side of the grounding unit. A groove (24) is formed on the upper sides of the molding compound resins by a laser process. |
