发明名称 METHOD FOR SCRIBING BRITTLE MATERIAL SUBSTRATE
摘要 [Object] To provide a method for scribing a brittle material substrate, such as a glass substrate, on which a resin layer is formed according to which a scribe line can be created efficiently without fail. [Means for Achieving Object] A cutter wheel (10) with notches (15) having a blade surface with two parts: one part having a first blade surface (12) with a first ridgeline angle (¸1) between the left and right sides, the ridgeline being the outer periphery of the circular cutter wheel, and the other part having a second blade surface (13) that continues to the bottom of the first blade surface (12) on the left and right sides, where the first ridgeline angle (¸1) is appropriate for cutting a brittle material substrate and the second blade surface (13) has an angle appropriate for cutting the resin layer, is provided, and this cutter wheel (10) is rolled over and pressed against the upper surface of a resin layer (3) so that the resin layer (3) is cut by the second blade surface (13), and at the same time the blade ridgeline of the first blade surface (12) bites into the substrate so as to create a scribe line.
申请公布号 KR101332242(B1) 申请公布日期 2013.11.22
申请号 KR20110110642 申请日期 2011.10.27
申请人 发明人
分类号 C03B33/02;C03B33/033;C03B33/037 主分类号 C03B33/02
代理机构 代理人
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