发明名称 ULTRA THIN TYPE WOVEN THERMOPLASTICS COMPLEX MATERIALS WITH REINFORCED INSULATION SURFACE OF SUBSTRATES
摘要 The present invention relates to an insulation surface substrate strengthening ultra-thin wafer type woven thermoplastic composite material and a method for manufacturing the same. Provided is an insulation surface substrate strengthening ultra-thin wafer type woven thermoplastic composite material characterized by including a woven-type middle layer laminated between an upper skin layer and a lower skin layer, or, either in the upper skin layer or in the lower skin layer, wherein the middle layer is formed by weaving of continuous fiber on a tape impregnated in a thermoplastic resin in a state in which reinforcing materials are continuously arranged, and a surface substrate layer having a heat insulation ability is laminated either in the upper skin layer or the lower layer. According to the present invention, the ultra-thin wafer type woven thermoplastic composite material has excellent moldability and workability so as to be suitable for components of the exterior and interior of vehicles and remarkably reduce the weight so as to enhance gas mileage of vehicles. [Reference numerals] (AA,CC) Skin layer;(BB) Continuous fiber-reinforced woven composite material
申请公布号 KR20130127163(A) 申请公布日期 2013.11.22
申请号 KR20120050899 申请日期 2012.05.14
申请人 HANWHA L&C CORPORATION 发明人 LEE, JAE SUB;BYEON, EUI HYEON;KIM, SE YONG;SHIN, DONG HWAN
分类号 B32B27/12;B32B5/12;B32B27/04;B32B37/02 主分类号 B32B27/12
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