| 摘要 |
PURPOSE: A wafer mount processing apparatus is provided to make mass production possible by forming a fixing part and a coating part for performing a process. CONSTITUTION: A base part is formed by combining a horizontal frame with a vertical frame. A support part (200) cleans and polishes a block. A coating part (300) loads a wafer on the upper surface of the block. A fixing part (400) cools and heats the block. A transport part moves the block or the wafer. [Reference numerals] (210) Block washing unit; (220) Block grinding unit; (230) Block drying unit; (310) Wafer washing unit; (320) Wafer coating unit; (330) Wafer heating unit; (410) Block heating unit; (420) Block cooling unit; (540) Block divide material; (600) Control unit; (AA,DD) Cassette loading; (DD,CC) Cassette unloading; (EE) Block unloading; (FF) Block loading |
