| 摘要 |
The present invention relates to a device for controlling the temperature of a solder paste. The device comprises a chamber and a temperature control unit. The chamber accommodates the solder paste in the inside and includes a nozzle in which the solder paste is sprayed to the outside at the end. The temperature control unit is installed on a lateral wall of the chamber and heats or cools the solder paste accommodated inside the chamber. |
