| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, capable of suppressing attachment and contamination of a semiconductor bonding adhesive to a bonding device, and achieving high reliability by suppressing a void.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: supplying a semiconductor bonding adhesive to a bump electrode formation surface of a semiconductor wafer on which a bump electrode having a tip composed of solder is formed (step 1); dicing the semiconductor wafer to obtain a semiconductor chip with the semiconductor bonding adhesive (step 2); allowing a bonding tool to suction and hold the semiconductor chip with the semiconductor bonding adhesive from a back surface (step 3); positioning the semiconductor chip with the semiconductor bonding adhesive to a circuit board (step 4); heating the semiconductor chip with the semiconductor bonding adhesive to a temperature equal to or more than a solder melting point to bond the bump electrode of the semiconductor chip with the semiconductor bonding adhesive to an electrode of the circuit board with the semiconductor bonding adhesive temporarily adhered thereto (step 5); and heating the semiconductor bonding adhesive under a pressurized atmosphere to remove a void (step 6). The semiconductor bonding adhesive has melt viscosity of 10kPa s or less at 60-100°C, and has a tack value of 10 gf/5 mm&phgr; or less at 25°C when measured by a probe tack method. |
