发明名称 LIQUID COMPOSITION USED FOR ETCHING OF MULTILAYER FILM CONTAINING COPPER AND MOLYBDENUM, AND ETCHING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a liquid composition used for etching of a multilayer film containing copper and molybdenum.SOLUTION: A liquid composition includes (A) a peroxosulfuric acid ion supply source, (B) a copper ion supply source, and (C) at least one nitrogen compound supply source selected from the group consisting of ammonia, ammonium ion, amine and alkyl ammonium ion, and has a pH of 3.5-9.
申请公布号 JP2013234385(A) 申请公布日期 2013.11.21
申请号 JP20130076295 申请日期 2013.04.01
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 YUBE KUNIO;TAMAI SATOSHI
分类号 C23F1/18;C09K13/00;C09K13/04;C23F1/26;C23F1/34;C23F1/38;H01L21/304 主分类号 C23F1/18
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