发明名称 |
RESIN COMPOSITION FOR HOLE SHRINK |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for hole shrink, capable of obtaining circular fine holes having uniform size by a hole shrink process.SOLUTION: The resin composition for hole shrink comprises: a block-copolymer (I) including an aromatic ring containing polymer and a poly (meta) acrylate as a block portion and having a molecular weight of 10,000 or more and 1 million or less (a ratio of the total of the aromatic ring containing polymer portion (Ia) and the poly (meta) acrylate portion (Ib) relative to the whole I is 50 mol % or more, and a molar ratio of Ia to Ib is 1:1 to 10:1.); and an aromatic ring containing homopolymer (II) consisting of a repeating unit constituting Ia of I as a by-product of I and having a molecular weight equal to or more than that of Ia of I. A ratio of II to I is more than 0 mass% and 10 mass% or less. |
申请公布号 |
JP2013235187(A) |
申请公布日期 |
2013.11.21 |
申请号 |
JP20120108591 |
申请日期 |
2012.05.10 |
申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
YORISUE TOMOHIRO;HAYASHI YOSHINOBU |
分类号 |
G03F7/40;C08F297/00;C08L25/02;C08L53/00;H01L21/027;H01L21/312 |
主分类号 |
G03F7/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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