| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the occurence of cracks in a joint part and deformation of a substrate in an electronic device and a manufacturing method of the electronic device.SOLUTION: An electronic device 1 includes: a first substrate 3 on which an electronic element 2 is mounted; a second substrate 4 that is disposed facing the first substrate 3 so as to sandwich the electronic element 2; and a frit 5 joining the first substrate 3 to the second substrate 4. The second substrate 4 has a thin part 41, where a thickness of a joint part formed by the frit 5 is formed thinner than the other portions, along its outer periphery. The thin part 41 inhibits the occurence of heat stress occurring in a substrate portion contacting with the frit 5 when the sealing is performed by the frit 5 in the manufacturing of the electronic device 1. The thin part 41 inhibits the occurence of cracks in the joint part. The thickness of the entire second substrate 4 may be increased except in the thin part 41. Thus, the thickness of the substrate is increased to inhibit the deformation. |
