发明名称 |
COOLING MECHANISM AND PROCESSING SYSTEM |
摘要 |
<p>Provided is a cooling mechanism (10) characterized by including: a plurality of support bases (54) provided in an air transfer chamber (6) where a downflow is formed and provided at a plurality of stages in the vertical direction; a plurality of support pins (56) provided for each of the support bases (54) and contacting the rear surface of an object to be processed (W) to support the object to be processed (W); and a wind guide plate (58) provided for the support base (54) in order to cool, with the downflow, the object to be processed (W) supported by support base (54) located at a lower stage of the plurality of support bases (54).</p> |
申请公布号 |
WO2013172209(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
WO2013JP62764 |
申请日期 |
2013.05.02 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KUMAGAI, KEITA;SASAKI, YOSHIAKI;KIKUSHIMA, HIROHITO;ITOMI, HAYATO |
分类号 |
H01L21/677;F24F7/06;F24F13/08;H01L21/02;H01L21/205 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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