| 摘要 |
PROBLEM TO BE SOLVED: To provide a negative photoresist based on a polyimide resin, which uses an alkali aqueous solution as a developing solution and requires a short developing time.SOLUTION: A negative photoresist is formed by disposing a photoresist layer comprising a photosensitive resin composition on a substrate, masking the layer in a desired pattern, irradiating the pattern surface with UV rays and processing the photoresist layer with a developing solution comprising an alkali aqueous solution. The photosensitive resin composition comprises a polyimide resin, an anion regenerator and a photoacid generator. The polyimide resin is prepared by reacting an acid dianhydride with a diamine compound, the acid dianhydride including an alicyclic acid dianhydride. The acid dianhydride may be a mixture of the alicyclic acid dianhydride and an aromatic acid dianhydride. A ratio (molar ratio) of the alicyclic acid dianhydride to the aromatic acid dianhydride is preferably 8:2 to 5:5. An aromatic diamine is preferable for the diamine compound. |
