发明名称 METHOD AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a package for elements, such as OLEDs, that have a function sensitive to temperatures.SOLUTION: A package comprises: a first glass substrate (12); a second glass substrate (16); and a wall (14) that separates the first substrate (12) and the second substrate (16) and hermetically seals at least one temperature sensitive element between the substrates (12,16). The wall (14) contains a sintered frit, and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 mm so as to obtain greater airtightness and strength in the package. The laser sealing is performed without substantially degrading the temperature sensitive elements (18,28,36) housed in the package.
申请公布号 JP2013235850(A) 申请公布日期 2013.11.21
申请号 JP20130153319 申请日期 2013.07.24
申请人 CORNING INC 发明人 STEPHAN L LOGUNOV;VICTOR M SCHNEIDER;JOHN D LOREY
分类号 H05B33/04;H01L51/50;H05B33/02;H05B33/10 主分类号 H05B33/04
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