PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, MOLDED PRODUCT AND ARTICLE

摘要

PROBLEM TO BE SOLVED: To provide a photocurable and thermosetting resin composition suitable for a functional film material and an antifouling scratch-resistant coating material.SOLUTION: As a resin composition, a silicon compound having the following structure is used as a main component of a siloxane unit. In the structure, a linking group between a (meth)acryloxy group as a photo-polymerizable group and silicon includes a urethane bond, and 1 to 5 (meth)acryloxy groups are linked to the same silicon atom by chemical bonds excluding a siloxane bond. In this way, by using the silicon compound, a distance between crosslinking points in a cured resin is increased compared to conventional compositions to alleviate curing shrinkage while keeping sufficient hardness. The hardness and toughness of a cured product are both achieved in a high level by a secondary interaction by a hydrogen bond between structural groups in the urethane bond moiety.