| 摘要 |
PROBLEM TO BE SOLVED: To improve the operation reliability of a semiconductor module which electrically connects an electrode layer of a semiconductor element with an electrode terminal by pressure-welding.SOLUTION: A lamination body provided with an AC electrode terminal 3 and a DC electrode terminal 4 is pressure welded to an electrode layer of a semiconductor element 2 by heat sinks 5, 6. The heat sinks 5, 6 are fixed by using a bolt 7a and a nut 7b. After the bolt 7a and the nut 7b are fastened, the bolt 7a and the nut 7b are welded by resistance welding. When pressure welding members 8, each of which is inserted into an exterior member 15 and directly presses the heat sink 5, are provided, the pressure welding parts 8 and the exterior member 15 are welded by the resistance welding after the pressure welding members 8 are fixed. |
