PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE

摘要

An apparatus configured to be coupled onto a substrate, wherein the apparatus comprises a semiconductor substrate and the semiconductor substrate includes a plurality of trenches defined within a side of the semiconductor substrate. The apparatus further comprises an interconnect layer over portions of the side of the semiconductor substrate, wherein the portions of the side of the semiconductor substrate include the plurality of trenches defined within the side of the semiconductor substrate. Each trench is configured to respectively receive a solder ball to provide an interface between i) the interconnect layer and ii) the substrate to which the apparatus is to be coupled.