| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive DC sputtering apparatus and a film deposition method capable of stably deposit a film for a long period of time and forming an excellent thin film by suppressing a damage on a substrate with a simple configuration.SOLUTION: A reactive DC sputtering apparatus 10 includes a target 11, a substrate holding part 12 facing the target 11, a circular anode electrode 13 provided adjacent to the substrate holding part 12 side of the target 11, a pulsed DC power supply 14 connected to the target 11, and a as supply means 16A supplying a deposition space with a mixed gas of inert gas and reactive gas, wherein the anode electrode 13 has a first aperture 19 and a second aperture 20 laminated adjacent to the substrate holding part 12 side of the first aperture 19, and the second aperture 20 has a plurality of through holes 20a penetrating in a thickness direction. |
