发明名称 RETROGRADE SUBSTRATE FOR DEEP TRENCH CAPACITORS
摘要 A semiconductor device includes a substrate having a first doped portion to a first depth and a second doped portion below the first depth. A deep trench capacitor is formed in the substrate and extends below the first depth. The deep trench capacitor has a buried plate that includes a dopant type forming an electrically conductive connection with second doped portion of the substrate and being electrically insulated from the first doped portion.
申请公布号 US2013307121(A1) 申请公布日期 2013.11.21
申请号 US201313936679 申请日期 2013.07.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BASKER VEERARAGHAVAN S.;HAENSCH WILFRIED E.;LEOBANDUNG EFFENDI;YAMASHITA TENKO;YEH CHUN-CHEN
分类号 H01L27/06 主分类号 H01L27/06
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