发明名称 |
FILM INSERT MOLDING FOR DEVICE MANUFACTURE |
摘要 |
Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components. |
申请公布号 |
WO2013172847(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
WO2012US38421 |
申请日期 |
2012.05.17 |
申请人 |
INTEL CORPORATION;DAVISON, PETER;PIDWERBECKI, DAVID |
发明人 |
DAVISON, PETER;PIDWERBECKI, DAVID |
分类号 |
G06F1/00;G06F1/16;G06F1/20 |
主分类号 |
G06F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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