| 摘要 |
<p>Provided is a hermetically closable electronic apparatus without hindering size reduction. An electronic apparatus (1) relating to the present invention is provided with a housing (60), and a panel (10) held in the housing (60), and the panel (10) includes a first bonding region that is bonded to the housing (60) by means of a first bonding member (70a), which is an adhesive.</p> |
