| 摘要 |
The present invention provides a novel Cu alloy film which has high adhesion to a substrate and/or an insulation film and exhibits low electric resistivity even after undergoing a thermal treatment. The present invention relates to a Cu alloy film which contacts with a substrate and/or an insulation layer directly on the substrate, wherein the Cu alloy film comprises a Cu-Mn-X alloy layer (a first layer) that contains an element X (Ag, Au, C, W, Ca, Mg, Al, Sn, B and/or Ni) and a layer (a second layer) that comprises pure Cu or a Cu alloy mainly composed of Cu and having lower electric resistivity than that of the first layer, and wherein the first layer and the second layer are arranged in this order when observed from the substrate side. |
