| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting diode structure and a manufacturing method of the light emitting diode structure.SOLUTION: A light emitting diode structure includes: an insulation substrate; multiple light emitting diode chips; and multiple wiring layers. Each light emitting diode chip includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer which are sequentially laminated on a surface of the insulation substrate. Each light emitting diode chip includes a mesa structure and an exposed portion of the first conductive type semiconductor layer, which are located adjacent to each other, and a first partition groove. The first partition groove is installed in the mesa structure. Each wiring layer connects adjacent light emitting diode chips. |
