发明名称 |
CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME |
摘要 |
In one implementation, a method of forming a conductive device can include depositing a non-conductive epoxy on a first portion of a lower surface of a semiconductor die, and can include depositing a conductive epoxy on a second portion of the lower surface of the semiconductor die. |
申请公布号 |
US2013307134(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201313947576 |
申请日期 |
2013.07.22 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
KUMAR JATINDER;CHONG DAVID |
分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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