Semiconductor device e.g. backside illumination (BSI) image sensor chip has several metal rings that are arranged to encircle clear color-filters that are arranged on backside of semiconductor substrate

摘要

The image sensor chip (20) includes a semiconductor substrate (26) having a front side (26A) and a backside (26B). Several image sensors (24) are arranged at the front side of the semiconductor substrate. Several clear color-filters are arranged on the backside of the semiconductor substrate. Several metal rings are arranged to encircle clear color-filters. Several metal rings are interconnected to form metal grid, such that colored color-filters are arranged in grid openings of metal grid. An independent claim is included for method for manufacturing semiconductor device.