Surface Polishing Apparatus

摘要

According to one aspect of the invention, there is provided a surface polishing apparatus comprising a base; a first magnet coupled to the base to have the first magnet be rotatable about a longitudinal axis of the first magnet; a second magnet coupled to the base to have the second magnet be rotatable about a longitudinal axis of the second magnet, wherein the first magnet and the second magnet are orientated to be in mutual attraction and wherein at least a portion of the first magnet is positioned adjacent to a portion of the second magnet with a gap between the adjacent portions; and a magnetic fluid reservoir containing magnetic fluid for performing surface polishing, the magnetic fluid reservoir positioned to allow the magnetic fluid to be in fluid communication with the gap.