| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology by which a position of 1 pin in a tabless package can be easily recognized.SOLUTION: Rear surfaces of a plurality of leads LE are exposed on a rear surface of a resin-sealed body MO that seals a semiconductor chip; an image recognition area PRA is further provided adjacent to 1 pin (lead LE with index 1); and a rear surface of an identification mark PP is exposed from the rear surface of the resin-sealed body MO in the image recognition area PRA. The identification mark PP is made of the same conductive member as the plurality of leads LE. |
