发明名称 Pb FREE In SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a Pb free In solder alloy superior in all of workability, wettability, and stress relieving, and having high reliability.SOLUTION: A Pb free In solder alloy contains at least one type from Sn and Ag, when the solder alloy contains Sn, its content is 0.01-11.00 mass%, and when the solder alloy contains Ag, its content is 0.01-21.00 mass%, and the rest is made of In and unavoidable impurities. The solder alloy can contain at least one type from Cu and Zn, when the solder alloy contains Cu, its content is 0.01-0.90 mass%, and when the solder alloy contains Zn, its content is 0.01-3.00 mass%. Also, the solder alloy can contain 0.500 mass% or less of P.
申请公布号 JP2013233577(A) 申请公布日期 2013.11.21
申请号 JP20120108358 申请日期 2012.05.10
申请人 SUMITOMO METAL MINING CO LTD 发明人 IZEKI TAKASHI;ARAI OSAMU;YAMAGUCHI KOICHI
分类号 B23K35/26;C22C28/00;H01L21/52;H05K3/34 主分类号 B23K35/26
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