发明名称 CIRCUIT BOARD AND PROCESS OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit board including a downsized coil and a process of manufacturing the same.SOLUTION: The circuit board includes a first insulating layer, a first magnetic material layer formed by plating on the first insulating layer, a plane coil formed on first magnetic material layer, and a second magnetic material layer formed by plating on the plane coil.
申请公布号 JP2013236046(A) 申请公布日期 2013.11.21
申请号 JP20120183523 申请日期 2012.08.22
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUJII TOMOJI
分类号 H05K3/46;H01L23/12;H05K1/16 主分类号 H05K3/46
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