| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method capable of forming a conductor film excellent in adhesion on a smooth electrical insulation substrate, not needing a highly heat resistant substrate, using inexpensive materials, and not installing a complex process such as modification of a substrate surface.SOLUTION: A plating method for forming a conductor film on a surface of an electrical insulation substrate includes: a coating film formation process for spreading a coating composition that contains metal particulates that is to be growth nuclei of plating and a binder that has adhesiveness to the surface of the substrate to form a coating film; a plasma treatment process for decomposing and removing organic components near the surface of the coating film by vacuum plasma to make the metal particulates expose to the surface of the coating film, and activating the exposed metal particulates; an electroless plating process for applying electroless plating to the plasma-treated surface of the coating film to form an electroless plating coating; and an electroplating process for applying electroplating to the surface of the electroless plating coating to develop the electroplating coating to a prescribed thickness. |
