发明名称 BONDING STRENGTH MEASUREMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding strength measurement method for easily and accurately measuring bonding strength in a shear direction of a bonded surface of a test piece bonded by a method, such as brazing, welding, weld depositing, and bonding.SOLUTION: A bonding strength measurement method, in which a tension load is applied in a shear direction of a bonded surface of a test piece of bonding strength formed by bonding plate-like test pieces that are partly overlapped with each other, includes the steps of: covering the test piece of bonding strength with an auxiliary tool satisfying characteristics (1) to (3) below so that one of the plate-like test pieces thereof projects from the auxiliary tool; applying a tension load to a plate-like test piece that is not covered with the auxiliary tool, and to a plate-like projection of the auxiliary tool; applying a shearing force to the bonded surface by transmitting the tension load from a projection inside the auxiliary tool to the bonded surface of each of the plate-like test pieces; and measuring a tensile strength when the bonded surface is sheared. Characteristics required for an auxiliary tool are as follows: (1) denseness preventing deformation under load in a direction other than that in a tensile direction of a test piece of bonding strength; (2) a projection for transmitting a tension load to a bonded surface of the test piece of bonding strength, which is provided inside the auxiliary tool; and (3) a plate-like projection for correcting misalignment in a direction of applying a tension load to the test piece of bonding strength, which is provided outside the auxiliary tool.
申请公布号 JP2013234909(A) 申请公布日期 2013.11.21
申请号 JP20120107325 申请日期 2012.05.09
申请人 TOSOH CORP 发明人 YAMANO NAOKI;TAKANO TAKESHI;HANATANI MAKOTO;GOTO HIROYUKI;SATO NAOMOTO
分类号 G01N3/00;G01N3/08 主分类号 G01N3/00
代理机构 代理人
主权项
地址