发明名称 INTER-BOARD CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To enable reductions in cost, pitch and height with a simple structure.SOLUTION: An inter-board connecting structure electrically connects between one board 21 including a plurality of through holes 24 provided with a plurality of connection lands 25 on at least a counter board side of the through holes 24, respectively, and the other board 22 provided with a plurality of connection lands 30 at positions corresponding to the connection lands 25 of the one board, respectively. Between the connection lands 25 of the one circuit 21 and the connection lands 30 of the other circuit 22, attached are connection terminals 23, respectively. The connection terminals 23 each include a connection head 38, and a support rod 39. The connection head 38 has numerous cavities therein. The numerous cavities are collapsed and deformed to thereby allow the connection head to be compressed only in a compression direction by the respective boards without escape in a lateral direction. The support rod 39 integrally provided in the connection head 38 supports the connection head 38 and is inserted into the through hole 24.
申请公布号 JP2013235871(A) 申请公布日期 2013.11.21
申请号 JP20120105305 申请日期 2012.05.02
申请人 MICRONICS JAPAN CO LTD 发明人 ITO TATSUYA
分类号 H05K1/14 主分类号 H05K1/14
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