WAFER-LEVEL PACKAGING MECHANISMS

摘要

The embodiments of mechanisms of wafer-level packaging (WLP) described above utilize a planarization stop layer to determine an end-point of the removal of excess molding compound prior to formation of redistribution lines (RDLs). Such mechanisms of WLP are used to implement fan-out and multi-chip packaging. The mechanisms are also usable to manufacture a package including chips (or dies) with different types of external connections. For example, a die with pre-formed bumps can be packaged with a die without pre-formed bumps.