SHEET HAVING ADHESIVE RESIN LAYER ATTACHED THERETO, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

[Problem] To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconductor device using the sheet. [Solution] The sheet having an adhesive resin layer attached thereto according to the present invention comprises a base and an adhesive resin layer laminated on the base, wherein the rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70°C for 1 minute is -0.5 to 0.5% and the bending resistance of the base is 80 mm or more.