| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which prevents the protruding of solder from a joining part at low costs when a semiconductor element is joined onto a metal substrate by soldering, and to provide a manufacturing method of the semiconductor module.SOLUTION: A semiconductor module according to this invention includes: a metal base plate 1a; an insulation layer 1b formed on the metal base plate; a metal pattern 1c formed on the insulation layer 1b; a semiconductor element 3 electrically joined to the metal pattern 1c; a module terminal 4 electrically joined to the metal pattern 1c; and oxides 1d formed around a joining part, which is provided on the metal pattern 1c and between the metal pattern 1c and the semiconductor element 3, and around a joining part, which is provided on the metal pattern 1c and between the metal pattern 1c and the module terminal 4. The metal pattern 1c and the semiconductor element 3 are joined to each other by soldering, and the metal pattern 1c and the module terminal 4 are joined to each other by soldering. The oxides 1d are collectively formed by heating the metal pattern 1c with a heated stamp. |
