| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device to which terminals are fixed with sufficient strength.SOLUTION: A semiconductor device 100 has a plurality of terminals 30 each including planar parts 30a to be bonded at predetermined connection positions by ultrasonic bonding. Each terminal 30 is bent so as to provide a predetermined space above an opposite side surface to a surface to be bonded at the connection point in each planar part 30a. All planar parts 30a included in each terminal 30 extend in a direction from the inside of the semiconductor device 100 toward the exterior of the semiconductor device 100. |
