| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of evaluating a semiconductor wafer and a device of evaluating a semiconductor wafer, capable of performing evaluation with higher accuracy and higher sensitivity in evaluation of breaking strength of a notch part of a semiconductor wafer.SOLUTION: In a method of evaluating breaking strength of a notch part 6 of a semiconductor wafer W, the notch part 6 of the semiconductor wafer W to be evaluated is broken by adding a load to the notch part 6 of the semiconductor wafer W toward the wafer center O, and thereby evaluating the breaking strength of the notch part 6. |
