| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique in which an element manufactured through a relatively low temperature (below 600°C) process is detached (i.e., separated) from a glass substrate and disposed (i.e., transferred) to a flexible substrate (typically a plastic film).SOLUTION: A separation layer containing a halogen element is formed over a glass substrate by using a plasma CVD method; a semiconductor element is formed over the separation layer; and separation is then performed inside the separation layer or at its interface, so that the large-area glass substrate and the semiconductor element are detached from each other. In order to perform detachment at the interface between the glass substrate and the separation layer, the separation layer may have a concentration gradient of the halogen element, and the halogen element is contained more near the interface between the separation layer and the glass substrate than in the other areas. |
