| 摘要 |
A manufacturing method according to an embodiment of the invention includes a first step of providing a sheet substrate having a piezoelectric resonator element and an integrated circuit disposed on a mounting surface of each substrate region, having implementation electrodes that are electrically connected to the integrated circuit disposed the side facing away from the mounting surface, and disposing wiring lines on the sheet substrate, the wiring liens electrically connecting the piezoelectric resonator element disposed in a first substrate region to the implementation electrode in a second substrate region in the vicinity of the piezoelectric resonator element, a second step of inputting and outputting a signal to and from the piezoelectric resonator element in the first substrate region via the implementation electrodes connected to the wiring lines, and a third step of dividing the sheet substrate along the substrate regions to cut the wiring lines.
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