发明名称 |
RADIATION SENSOR WITH PHOTODIODES BEING INTEGRATED ON A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING INTEGRATION PROCESS |
摘要 |
An embodiment relates to a sensor integrated on a semiconductor substrate and comprising at least one first and second photodiode including at least one first and one second p-n junction made in such a semiconductor substrate as well as at least one first and one second antireflection coating made on top of such a first and second photodiode. At least one antireflection coating of such a first and second photodiode comprises at least one first and one second different antireflection layer to make a double layer antireflection coating suitable for obtaining for the corresponding photodiode a responsivity peak at a predetermined wavelength of an optical signal incident on the sensor. An embodiment also refers to an integration process of such a sensor, as well as to an ambient light sensor made with such a sensor.
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申请公布号 |
US2013309803(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201313828170 |
申请日期 |
2013.03.14 |
申请人 |
STMICROELECTRONICS S.R.I.;STMICROELECTRONICS S.R.L. |
发明人 |
CASTAGNA MARIA ELOISA;LEONARDI SALVATORE;ABBISSO SALVATORE;MADDIONA LIDIA |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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