发明名称 RADIATION SENSOR WITH PHOTODIODES BEING INTEGRATED ON A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING INTEGRATION PROCESS
摘要 An embodiment relates to a sensor integrated on a semiconductor substrate and comprising at least one first and second photodiode including at least one first and one second p-n junction made in such a semiconductor substrate as well as at least one first and one second antireflection coating made on top of such a first and second photodiode. At least one antireflection coating of such a first and second photodiode comprises at least one first and one second different antireflection layer to make a double layer antireflection coating suitable for obtaining for the corresponding photodiode a responsivity peak at a predetermined wavelength of an optical signal incident on the sensor. An embodiment also refers to an integration process of such a sensor, as well as to an ambient light sensor made with such a sensor.
申请公布号 US2013309803(A1) 申请公布日期 2013.11.21
申请号 US201313828170 申请日期 2013.03.14
申请人 STMICROELECTRONICS S.R.I.;STMICROELECTRONICS S.R.L. 发明人 CASTAGNA MARIA ELOISA;LEONARDI SALVATORE;ABBISSO SALVATORE;MADDIONA LIDIA
分类号 H01L31/18 主分类号 H01L31/18
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