发明名称 RUGGEDIZED PHOTONIC CRYSTAL SENSOR PACKAGING
摘要 PROBLEM TO BE SOLVED: To provide a method, a system and an apparatus for a ruggedized photonic crystal (PC) sensor packaging.SOLUTION: A ruggedized packaging for a photonic crystal (PC) sensor 220 includes: a hermetic-seal high-temperature jacket 292; and a ferrule 290 that eliminates exposure of an optical fiber as well as a critical part of the photonic crystal sensor 220 to harsh environments. By the packaging method, the sensor 220 based on the photonic crystal can be operated in a challenging environment where adverse environmental conditions such as an electromagnetic interference (EMI), a corrosive fluid, large temperature variations and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.
申请公布号 JP2013235000(A) 申请公布日期 2013.11.21
申请号 JP20130097472 申请日期 2013.05.07
申请人 BOEING CO:THE 发明人 MICHAEL A CARRALERO;CHAN ERIC Y;DENNIS G KOSHINZ
分类号 G01D5/353;G02B6/42 主分类号 G01D5/353
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