| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, which has excellent reflow resistance, and low viscosity when molded, and is excellent in continuous workability; and to provide a semiconductor device using the same.SOLUTION: An epoxy resin composition for sealing semiconductors, comprising an epoxy resin, a curing agent, an inorganic filler, and a silane coupling agent as essential components, is characterized by including a naphthalene skeleton-containing epoxy resin represented by formula (I) (wherein Rand Rare each H, alkyl, or the like; l is an integer of 1-5; OG is glycidyl ether) and a phenyl skeleton-containing epoxy resin represented by formula (II) (wherein Rand Rare each H, alkyl, or the like; m is an integer of 0-2; n is an integer of 1-4; and OG is glycidyl ether). |
