| 摘要 |
PROBLEM TO BE SOLVED: To reduce a down time caused by the generation of abnormal discharge by a nodule to achieve high productivity in a sputtering apparatus that uses a rotating cylinder sputtering target.SOLUTION: A sputtering apparatus that uses a rotating cylinder sputtering target 20 includes a nodule removing section 100 and a distance changing mechanism 110 for changing the distance between the nodule removing section 100 and the target 20, wherein a nodule removing member takes a position (a) where it touches the target and a position (b) away from the target. |
