| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device mounted on a mounting substrate by using balls.SOLUTION: A feature in one embodiment is forming lands, on which solder balls SB1 disposed at an inner region of a chip mounting region (a broken-line) are mounted, into a Non-Solder Mask Defined (NSMD) structure. That is, the lands, on which the solder balls SB1 disposed so as to planarly overlap with the chip mounting region from among a rear surface of a through wiring board THWB are mounted, are formed into the NSMD structure. Specifically, the lands assigned to the dotted solder balls SB1 are formed into the NSMD structure. |
