| 摘要 |
PROBLEM TO BE SOLVED: To quickly obtain a proper laser anneal processing condition.SOLUTION: A laser annealing device comprises: plural electrodes (5a-5d) that can contact a surface of a silicon substrate (B) nearer a rear part in a scanning direction than a laser radiation position of a laser radiation spot (11); a resistance measurement circuit (16) for measuring a resistance between the electrodes (5b, 5c); and sheet resistivity calculation means (17) for calculating sheet resistivity from the measured resistance. The sheet resistivity can be measured without taking the sheet from the laser annealing device, and the sheet is not contaminated by ambient air and the like, so as to quickly obtain correct measurement results. Accordingly, a proper laser anneal processing condition can be quickly obtained. |
