发明名称 SOUND INSULATION COVER AND SOUND INSULATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a sound insulation cover and a sound insulation structure which enable the installation from a front side of a wall.SOLUTION: A sound insulation cover 21 includes a cover body 25 formed by a flexible material having a specific gravity of 2 or higher and having sound insulation properties. The cover body 25 includes an opening 20a on a front surface and is formed into a box shape that may house a wiring tool 42 installed on a lightweight partition wall W from an opening 20a. Further, the sound insulation cover 21 includes a flange part 26 extending from a front surface of the cover body 25 to the exterior. In the sound insulation cover 21, the cover body 25 is inserted into a wall hole Wb from the front side of the lightweight partition wall W, and the flange part 26 is disposed at a periphery of the wall hole Wb on a surface of the lightweight partition wall W.
申请公布号 JP2013236511(A) 申请公布日期 2013.11.21
申请号 JP20120108553 申请日期 2012.05.10
申请人 MIRAI IND CO LTD 发明人 YASUDA MASAYUKI
分类号 H02G3/08;H02G3/02 主分类号 H02G3/08
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