| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, which has a low viscosity and good moldability, maintains reflow resistance, and has improved storability at high temperature.SOLUTION: An epoxy resin composition for sealing semiconductors, comprising an epoxy resin, a curing agent and an inorganic filler, is characterized by including (A) an epoxy resin having a biphenyl aralkyl molecular skeleton and (B) at least one epoxy resin selected from a bisphenol A type epoxy resin and a bisphenol F type epoxy resin as the epoxy resin, and containing the inorganic filler in an amount of ≥60 mass% and ≤95 mass% based on the total amount of the composition. |
